The ultimate solution for high-precision PCB singulation, combining advanced laser technology with intelligent automation. This system streamlines the entire process—from loading and process management to final inspection and stacking—for a truly unmanned smart factory environment.
Unmanned Inline System: Achieves 100% autonomous operation from vacuum-suction loading to final material sorting and unloading.
MES Integration & Smart Recipe: Automated model recognition via barcode scanning links directly to the MES, loading optimal recipes instantly and eliminating setup downtime.
Automated Sorting & Stacking: Intelligently categorizes and stacks finished PCBs into designated trays based on real-time vision inspection results.
World-Class Process Capability: Delivers a Cp of 2.00, significantly outperforming mechanical routers Cp 0.59 to ensure near-zero defect production.
Ultra-Narrow Gap Cutting: Enables high-density PCB designs with an 0.08mm cutting gap, surpassing the physical limits of traditional mechanical bits.
Low-Temp Non-Contact Processing: Maintains surface temperatures below 64°C and eliminates mechanical stress, preventing micro-cracks and thermal damage to sensitive components.
Autonomous Path Compensation: High-resolution vision systems detect material offsets in real-time and adjust the laser path automatically for perfect alignment.
Inline Quality Inspection: Performs real-time dimensional and aesthetic checks post-cutting, logging all data for complete production traceability and quality assurance.