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Your Optimal Laser Solution Partner — WorldWell Laser

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Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router
Inline Laser PCB/FPCB Router

Inline Laser PCB/FPCB Router

Features
  • Stress-Free Cutting: Non-contact laser prevents micro-cracks and circuit damage.
  • In-line Optimization: Stable interface designed for seamless automated production lines.
  • Versatile Laser Sources: Supports various sources including Nano, Pico, and Femto lasers.
  • Power Monitoring Option: Real-time laser power measurement for reliable process data.
  • Minimal Maintenance: No consumable bits and dust-free operation for cleanroom use.

Product Details

1. Superior Precision & Repeatability

  • Exceptional Process Capability (Cp/Cpk): Achieves a Cp of 2.00, significantly outperforming traditional routers (Cp 0.59) for near-zero defect production.

  • Ultra-Narrow Gap Cutting: Supports cutting distances as small as 0.08mm , allowing for 20-40% more space in high-density PCB designs compared to mechanical bits.


2. Advanced Thermal Management

  • Low-Temperature Processing: Maintains surface temperatures below 64°C (vs. 150°C in routers), ensuring zero thermal damage to sensitive SMT components and micro-circuits.

  • Minimized HAZ (Heat-Affected Zone): Prevents discoloration and warping, making it ideal for multi-layer and Flex-Rigid PCB applications.


3. Enhanced Signal Integrity & Design Freedom

  • Noise & Vibration Control: Non-contact processing eliminates mechanical stress, maintaining signal integrity and reducing crosstalk for high-speed data transmission.

  • Complex Geometry Support: No constraints on bit diameter; easily processes curves, sharp angles, and custom shapes without molds, shortening the R&D cycle by up to 70%.


4. Maximum Efficiency & Cost Reduction

  • 95% Material Utilization: The ultra-fine laser beam (0.02-0.1mm) minimizes waste, maximizing board usage and reducing production costs.

  • Maintenance-Free Operation: Eliminates the need for tool changes and manual recalibration. Fully smart factory-ready with MES integration and automated vision compensation.

Spec.