Products
solder ball Laser soldering machine
- Non-Contact Precision Soldering: Fiber-delivered laser technology enables stable and precise non-contact soldering for micro components and delicate electronic parts
- Instant High-Energy Melting: High-pulse laser energy instantly melts the solder ball, ensuring fast and uniform bonding quality
- Nitrogen Gas Injection System: High-pressure nitrogen gas precisely transfers molten solder onto the joint surface, reducing oxidation and improving bonding reliability
- High-Precision CCD Vision System: Integrated CCD positioning and height measurement functions minimize alignment errors and ensure highly accurate automatic soldering
- Smart Multi-Axis Motion Control: Advanced multi-axis motion platform provides stable and precise operation for complex product geometries and automated processes
- User-Friendly Design: Intuitive interface and error-prevention features allow safe and easy operation for operators
- Optimized for Automation Lines: Designed for SMT and electronic assembly automation, delivering high productivity and consistent soldering quality
Product Details
1. Non-Contact Processing System
Non-Contact Precision Processing:
The non-contact laser soldering system protects PCB substrates through precise laser power control.
Stable Output Performance:
Maintains consistent solder ball melting shape by delivering uniform laser energy even during long continuous operation.
2. Precision Soldering System
Vision Solution:
High-resolution vision positioning and tracking system enables micron-level precision soldering.
Reduced Consumables:
Minimizes maintenance costs by reducing consumable parts such as soldering tip replacements.
3. Automation Integrated Solution
Optimized for Automation:
The non-contact process is highly suitable for various automated production environments.
Real-Time MES Integration:
Process data can be matched and transmitted directly to the Manufacturing Execution System (MES), ensuring production transparency and traceability.
